DoD FUNDING OPPORTUNITIES

DARPA Ultra-Wide BandGap Semiconductors (UWBGS) Microsystems Technology Office – Abstract Due November 1, 2023; Proposal Due December 15, 2023

The Microsystems Technology Office at DARPA seeks innovative proposals to develop foundational ultra-wide bandgap (UWBG) materials (substrate, device layers, and junctions) and low resistance electrical contacts necessary for realization of devices that enable UWBG applications. In particular, DARPA seeks proposals in the following areas: 1) low defect density, large area (100 mm diameter), epi-ready, UWBG substrates and 2) uniform, low defect density UWBG device layers with high doping efficiency, abrupt homo- and/or hetero-junctions with low junction defect density (1012/cm2 ), and ultra-low resistance electrical contacts (2 x 10-6 ohm-cm2 ). It is anticipated that the technical approaches to meet these goals will be different, and therefore, separate proposals are required for each Technical Area. Proposed research should investigate innovative approaches that enable revolutionary advances in materials, devices, circuits, and systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice.

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DARPA Microsystems Exploration – September 28, 2024

MTO seeks to develop high-risk, high-reward technologies that enable revolutionary advances in materials, devices, and microsystems and continue DARPA’s mission of creating and preventing strategic surprise. In order to capitalize rapidly on new opportunities, DARPA announces the Microsystems Exploration program which calls for faster responses with smaller, targeted investments.

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